Plate-shaped body for temperature measurement and temperature measuring apparatus provided with the same

A temperature measuring apparatus comprising:

• a temperature measurement plate comprising:
• a wafer having an insulating adhesive on one main surface of the wafer;
• a heating member on the insulating adhesive;
• a plurality of temperature measurement regions provided on the insulating adhesive;
• and an insulating film covering the heating member and the plurality of temperature measurement regions;
• an electrostatic chuck apparatus comprising:
• an electrostatic chuck section having a mounting surface;
• and a cooling base section;
• a thermograph;
• and
• a sealed container compromising a ceiling plate having a window,
• wherein the insulating adhesive includes any one type of an acrylic-based adhesive, an epoxy-based adhesive, and a polyimide amide-based adhesive,
• the insulating film is formed of polytetrafluoroethylene, polyimide, or polyamide,
• the wafer is configured to be mountable on the mounting surface such that the temperature measurement regions face the thermograph via the insulating film and to be removable from the mounting surface,
• the electrostatic chuck apparatus is stored in a bottom section of the sealed container,
• the thermograph is provided outside the ceiling plate and faces the electrostatic chuck apparatus via the window, and
• the plurality of temperature measurement regions are arrayed in one row at predetermined intervals from each other and are connected with each other.