Laser processing system having measurement function

A laser processing system for performing various types of laser processing, the laser processing system comprising:

• a processing head configured to irradiate an object with a laser beam in a scanning manner via a processing-use optical system;
• an illumination-light emitting section provided in the processing head, the illumination-light emitting section including an illumination-use optical system and configured to cause illumination light generated by a light source to be emitted via the illumination-use optical system from the processing head toward the object along an optical axis of the processing-use optical system;
• a light receiving section located in a predetermined positional relationship with the illumination-light emitting section, and configured to receive a reflection of the illumination light reflected at an irradiated point on the object;
• and
• a measurement section configured to process the reflection received by the light receiving section and obtain three-dimensional measurement data of the irradiated point,
• wherein
• the processing head includes a scanning device configured to cause the laser beam to perform a scanning motion,
• the illumination-light emitting section is configured to cause the illumination light to be emitted from the processing head in a scanning manner via the scanning device,
• the illumination-light emitting section is configured to cause the illumination light to perform a scanning motion in a first direction by an operation of the scanning device and irradiate the object with the illumination light,
• the light receiving section is configured to process a trajectory of an imaging point of the illumination light, the imaging point moving in the first direction along the object, so as to obtain captured image data of a linearly-continuous reflection, and
• the measurement section is configured to process the captured image data so as to obtain the three-dimensional measurement data.

A laser processing system for performing various types of laser processing, the laser processing system comprising:

• a processing head configured to irradiate an object with a laser beam in a scanning manner via a processing-use optical system;
• an illumination-light emitting section provided in the processing head, the illumination-light emitting section including an illumination-use optical system and configured to cause illumination light generated by a light source to be emitted via the illumination-use optical system from the processing head toward the object along an optical axis of the processing-use optical system;
• a light receiving section located in a predetermined positional relationship with the illumination-light emitting section, and configured to receive a reflection of the illumination light reflected at an irradiated point on the object;
• a measurement section configured to process the reflection received by the light receiving section and obtain three-dimensional measurement data of the irradiated point;
• a moving device configured to make the object move relative to the processing head and the light receiving section;
• a motion controlling section configured to control an operation of the moving device;
• and
• a motion correcting section configured to correct the operation of the moving device based on the three-dimensional measurement data.

A laser processing system for performing various types of laser processing, the laser processing system comprising:

• a processing head configured to irradiate an object with a laser beam in a scanning manner via a processing-use optical system;
• an illumination-light emitting section provided in the processing head, the illumination-light emitting section including an illumination-use optical system and configured to cause illumination light generated by a light source to be emitted via the illumination-use optical system from the processing head toward the object along an optical axis of the processing-use optical system;
• a light receiving section located in a predetermined positional relationship with the illumination-light emitting section, and configured to receive a reflection of the illumination light reflected at an irradiated point on the object;
• a measurement section configured to process the reflection received by the light receiving section and obtain three-dimensional measurement data of the irradiated point;
• a scanning-motion controlling section configured to control a scanning motion of the laser beam or the illumination light;
• and
• a scanning-motion correcting section configured to correct the scanning motion of the laser beam based on the three-dimensional measurement data.

A laser processing system for performing various types of laser processing, the laser processing system comprising:

• a processing head configured to irradiate an object with a laser beam in a scanning manner via a processing-use optical system;
• an illumination-light emitting section provided in the processing head, the illumination-light emitting section including an illumination-use optical system and configured to cause illumination light generated by a light source to be emitted via the illumination-use optical system from the processing head toward the object along an optical axis of the processing-use optical system;
• a light receiving section located in a predetermined positional relationship with the illumination-light emitting section, and configured to receive a reflection of the illumination light reflected at an irradiated point on the object;
• a measurement section configured to process the reflection received by the light receiving section and obtain three-dimensional measurement data of the irradiated point;
• and
• a blind-area identifying section configured to identify a blind area on the object, the blind area being not irradiated with the laser beam or the illumination light, based on the three-dimensional measurement data.