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US 10,502,499 B2Granted
Heat storage molded body, heat storage laminate, and heat storage molded body production method
AssigneeDIC Corporation
InventorsKenichi Fujisaki, Yuko Koseki
Life of this patent
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Abstract
A heat storage molded body includes a heat storage medium dispersed in a resin matrix, wherein the resin matrix includes a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, and wherein the Hansen Solubility Parameter (HSP) distance between the non-phthalate plasticizer and the heat storage medium is 6 or more.
Claims9
A heat storage molded body comprising
- a heat storage medium dispersed in a resin matrix, wherein the heat storage medium is heat storage particles containing a latent heat storage material encapsulated therein and the latent heat storage material shows a solid/liquid phase transition in a temperature range of −20° C. to 120° C.,
- wherein the resin matrix comprises a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, and
- wherein the Hansen Solubility Parameter (HSP) distance between the non-phthalate plasticizer and the heat storage medium is 6 or more.
Dependencies are inferred from the claim text.