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US 10,502,369 B2Granted
Circuit board and image forming apparatus
AssigneeCanon Kabushiki Kaisha
InventorJun Hirabayashi
Life of this patent
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AssigneeCanon Kabushiki Kaisha
InventorJun Hirabayashi
Estimating the term…
The circuit board has a surface mount LED with a lens on the circuit board. A conductive portion and remaining space in the periphery of the LED are covered with solid copper foil so that reflectance of light and a heat dissipation effect are enhanced. In addition, layer structures between the circuit board and an assembled component are the same between contact portions with the assembled component so that tilt in mounting the board is suppressed. As a result, the circuit board having mounted thereon the surface mount LED having high directivity can be accurately mounted on the assembled component, tilt of an optical axis can be suppressed, the reflectance of light from the LED can be increased, and the heat dissipation effect can be enhanced.
A circuit board having a surface on which a light emitting element is mounted, wherein the surface of the circuit board comes into contact with a supporting member including a first support portion and a second support portion to be positioned with regard to the supporting member, the circuit board, comprising:
A circuit board having a first opening and a second opening, wherein the circuit board on which a light emitting element is mounted is supported by a supporting member having a first protruding portion and a second protruding portion, the circuit board comprising:
Dependencies are inferred from the claim text.