Cooling device for hot-dip plated steel sheet
AssigneeNippon Steel Corporation
InventorsTooru Oohashi, Kazuki Machida, Hiroshi Nakata, Katsuya Kojima, Kohhei Hayakawa
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AssigneeNippon Steel Corporation
InventorsTooru Oohashi, Kazuki Machida, Hiroshi Nakata, Katsuya Kojima, Kohhei Hayakawa
Estimating the term…
The present invention provides a cooling device for a hot-dip plating device provided on an upper side of a plating thickness control device in a conveyance route of a hot-dip plated steel sheet that is conveyed from a plating bath in a vertically upward direction. The cooling device includes: a main cooling device that vertically sprays a main cooling gas to the hot-dip plated steel sheet; and a preliminary cooling device that is provided in a preliminary cooling section between the main cooling device and the plating thickness control device in the conveyance route, and sprays a preliminary cooling gas to a plurality of gas collision positions which are set along the preliminary cooling section.
A cooling device for a hot-dip plated steel sheet which is provided on an upper side of a plating thickness control device, including a pair of wiping nozzles, in a conveyance route of the hot-dip plated steel sheet that is conveyed from a plating bath in a vertically upward direction, the cooling device comprising:
Dependencies are inferred from the claim text.