Method for reducing the speed of propagation of a crack in a metal substrate

Abstract

A method for reducing the speed of propagation of a crack in a metal substrate by means of laser heat treatment can include heating the metal substrate with a laser heat treatment at one or more crack ends, wherein the laser beam is guided over the substrate surface so that it defines the form of an oval, an arc or a curve. Alternatively, the substrate can be treated by means of laser heat treatment before a crack arises. For example, areas at risk of cracking are identified in a metal substrate and the metal substrate is then heated by means of laser heat treatment in these areas, wherein the laser beam is guided over the substrate surface so that it defines the form of an oval, an arc or a curve. Also disclosed herein are metal substrates produced by the method and the use thereof.

Dependencies are inferred from the claim text.