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US 10,501,710 B2Granted
Cleaner composition and preparation of thin substrate
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsMasaya Ueno, Hideyoshi Yanagisawa
Life of this patent
Estimating the term…
Abstract
A cleaner composition consisting essentially of (A) 90.0-99.9 wt % of an organic solvent and (B) 0.1-10.0 wt % of a C3-C6 alcohol, and containing (C) 20-300 ppm of sodium and/or potassium is effective for cleaning a surface of a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.
Claims11
A cleaner composition for cleaning a surface of a substrate, consisting essentially of
- (A) 90.0 to 99.9% by weight of an organic solvent exclusive of an alcohol of 3 to 6 carbon atoms, and
- (B) 0.1 to 10.0% by weight of an alcohol of 3 to 6 carbon atoms,
- the composition containing (C) sodium and/or potassium in an amount of 0.002 to 0.03 part by weight per 100 parts by weight of components (A) and (B) combined,
- wherein the organic solvent (A) is an aliphatic hydrocarbon of 5 to 20 carbon atoms or a dialkylene glycol dialkyl ether of 5 to 20 carbon atoms, wherein the composition is free of water.
1 more element
A method for preparing a thin substrate, comprising the steps of
- (a) forming an adhesive layer on a substrate or handle substrate from an adhesive composition and bonding the substrate and the handle substrate via the adhesive layer,
- (b) processing the substrate bonded to the handle substrate,
- (c) separating the substrate as processed from the handle substrate, the adhesive layer remaining on the substrate after separation, and
- (d) cleaning away the adhesive layer on the substrate with the cleaner composition, wherein the cleaner composition consisting essentially of
- (A) 90.0 to 99.9% by weight of an organic solvent exclusive of an alcohol of 3 to 6 carbon atoms, and
- (B) 0.1 to 10.0% by weight of an alcohol of 3 to 6 carbon atoms,
- the composition containing (C) sodium and/or potassium in an amount of 0.002 to 0.03 part by weight per 100 parts by weight of components (A) and (B) combined, wherein the organic solvent (A) is an aliphatic hydrocarbon of 5 to 20 carbon atoms or a dialkylene glycol dialkyl ether of 5 to 20 carbon atoms, wherein the composition is free of water.
4 more elements
Dependencies are inferred from the claim text.