Back to results
US 10,501,671 B2Granted
Gel-type thermal interface material
AssigneeHoneywell International Inc.
InventorsLiqiang Zhang, Huifeng Duan, Kai Zhang, Ya Qun Liu, Ling Shen, Wei Jun Wang, Haigang Kang
Life of this patent
Estimating the term…
Abstract
A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.
Claims19
A thermal interface material comprising:
- at least one low molecular weight silicone oil having a weight (Mw) average molecular weight less than 50,000 Daltons;
- at least one thermally conductive filler;
- and
- at least one high molecular weight silicone oil, wherein the high molecular weight silicone oil comprises a vinyl functional silicone oil having a weight (Mw) average molecular weight of at least 60,000 Daltons and having a kinematic viscosity of at least 100,000 cSt.
1 more element
A thermal interface material comprising:
- at least one high molecular weight vinyl functional silicone oil having a weight (Mw) average molecular weight of at least 60,000 Daltons and a kinematic viscosity of at least 100,000 cSt;
- at least one low molecular weight silicone oil having a weight (Mw) average molecular weight less than 50,000 Daltons;
- at least one thermally conductive filler;
- and
- at least one addition inhibitor, wherein the addition inhibitor comprises an alkynyl compound.
2 more elements
An electronic component comprising:
- a heat sink;
- an electronic chip;
- a thermal interface material having a first surface layer and a second surface layer, the thermal interface material positioned between the heat sink and electronic chip, the thermal interface material including:
- at least one silicone oil having a kinematic viscosity of at least 100,000 cSt;
- at least one thermally conductive filler;
- and
- at least one addition inhibitor, wherein the addition inhibitor comprises an alkynyl compound, wherein the at least one silicone comprises at least one low molecular weight silicone oil and at least one high molecular weight silicone oil.
4 more elements
Dependencies are inferred from the claim text.