Resin compositon, removable adhesive layer, IC substrate, and IC packaging process

A removable adhesive layer formed by curing a resin composition, the resin composition comprising:

• a styrene-butadiene-styrene block copolymer;
• and
• a plurality of hydrated inorganic substances and/or a plurality of microcapsule particles dispersed in the styrene-butadiene-styrene block copolymer;
• wherein the plurality of hydrated inorganic substances dehydrate to form anhydrous inorganic substances at a dehydration temperature greater than 250 degrees Celsius, each of the plurality of microcapsule particle comprises a housing and an embedded object encapsulated therein, the embedded object will largely volatilize from the housing at an escaping temperature greater than 250 degrees Celsius.

An IC packaging process comprising:

• providing an IC substrate comprising:
• a carrier;
• a circuit structure;
• and
• a removable adhesive layer attached between the carrier and the circuit structure a styrene-butadiene-styrene block copolymer, the removable adhesive layer formed by curing a resin composition;
• wherein the resin composition comprises a styrene-butadiene-styrene block copolymer, and the resin composition further comprises a plurality of hydrated inorganic substances and/or a plurality of microcapsule particles dispersed in the styrene-butadiene-styrene block copolymer, the plurality of hydrated inorganic substances dehydrate to form anhydrous inorganic substances at a dehydration temperature greater than 250 degrees Celsius, each of the plurality of microcapsule particle comprises a housing and an embedded object encapsulated therein, the embedded object will largely volatilize from the housing at an escaping temperature greater than 250 degrees Celsius;
• mounting an integrated circuit on a side of the circuit structure 13 facing away from the carrier by a surface mount technology, the surface mount technology applying in a mounting temperature, wherein each of the dehydration temperature and the escaping temperature is greater than the mounting temperature;
• encapsulating the integrated circuit on the IC substrate by a packaging structure to form an intermediate structure;
• and
• heating the intermediate structure at a heating temperature greater than or equal to the dehydration temperature and/or the escaping temperature, to cause gas to be produced by the hydrated inorganic substances or the microcapsule particles and release from the removable adhesive layer;
• peeling off the removable adhesive layer from the circuit structure.

An IC substrate comprising:

• a carrier;
• a circuit structure;
• and
• a removable adhesive layer attached between the carrier and the circuit structure a styrene-butadiene-styrene block copolymer, the removable adhesive layer formed by curing a resin composition;
• wherein the resin composition comprises a styrene-butadiene-styrene block copolymer, and the resin composition further comprises a plurality of hydrated inorganic substances and/or a plurality of microcapsule particles dispersed in the styrene-butadiene-styrene block copolymer, the plurality of hydrated inorganic substances dehydrate to form anhydrous inorganic substances at a dehydration temperature greater than 250 degrees Celsius, each of the plurality of microcapsule particle comprises a housing and an embedded object encapsulated therein, the embedded object will largely volatilize from the housing at an escaping temperature greater than 250 degrees Celsius.