Method for manufacturing electrically conductive adhesive film, electrically conductive adhesive film, and method for manufacturing connector
AssigneeDexerials Corporation
InventorSeiichiro Shinohara
Life of this patent
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AssigneeDexerials Corporation
InventorSeiichiro Shinohara
Estimating the term…
A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.
An electrically conductive adhesive film comprising:
An electrically conductive adhesive film comprising:
An electrically conductive adhesive film comprising:
A method for manufacturing an electrically conductive adhesive film comprising:
Dependencies are inferred from the claim text.