Resin composition, and electronic component and electronic device using same

A resin composition comprising a silicone resin, an inorganic filler, and an inorganic pigment particle,

• the inorganic filler including a first filler having thermal emissivity, and a second filler having thermal conductivity, wherein the second filler is contained in a volume ratio of 2.5 or more and 4.0 or less with respect to the first filler,
• the inorganic filler being contained in a proportion of 46.8 volume % or more and 76.3 volume % or less with respect to a combined volume of the silicone resin, the inorganic filler, and the inorganic pigment particle,
• wherein the first filler is an oxide having an average particle size of 7.8 μm or more and 18 μm or less, and containing at least two elements selected from the group consisting of aluminum, magnesium, and silicon,
• wherein the second filler is a SiC having an average particle size of 9.5 μm or more and 25 μm or less, and a purity of 92% or more, and
• wherein the inorganic pigment particle has an average particle size of 28 nm or more and 39.5 nm or less, and a specific surface area of 84 m2/g or more and 800 m2/g or less.