Wire processing system

A wire processing system, comprising:

• a long-wire supporting tray of a wire processing machine having a loop puller mechanism configured to sequentially pull a first wire and a second wire from a wire feed system along a lengthwise direction of the long-wire supporting tray and form a loop in the first wire and the second wire on the long-wire supporting tray;
• the long-wire supporting tray having a tray surface including a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire;
• and
• the wire-to-surface coefficient of friction reducing movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.