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US 10,500,858 B2Granted
Printed circuit board fluid ejection apparatus
AssigneeHewlett-Packard Development Company, L.P.
InventorsGary G. Lutnesky, Silam J. Choy
Life of this patent
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Abstract
In an example, a fluid ejection apparatus includes a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board, and a cavity. A printhead die may be embedded in a molding material in the cavity.
Claims19
A fluid ejection apparatus comprising:
- a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board;
- and
- a printhead die electrically connected to the conductor layer and embedded in a molding material, the printhead die disposed in a cavity in the printed circuit board;
- wherein the printhead die includes a through-silicon via extending to a bottom surface to electrically connect the printhead die to the conductor layer;
- wherein the molding material embedding the printhead die is level with the cover layer.
2 more elements
A fluid ejection apparatus comprising:
- a plurality of printhead dies;
- a printed circuit board having a conductor layer and a cavity in which the plurality of printhead dies are disposed, the printhead dies being embedded in a molding material in the cavity;
- and
- a cover layer forming a surface of the printed circuit board and having an opening exposing a bond pad of the conductor layer, and wherein each of the plurality of printhead dies is electrically connected to the bond pad;
- wherein the plurality of printhead dies are arranged end-to-end in two rows across the printed circuit board, and wherein placement of the printhead dies is staggered such that ends of the printhead dies overlap laterally between the two rows.
2 more elements
A method for making a fluid ejection apparatus, comprising:
- providing a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board, wherein the cover layer includes an opening exposing a bond pad of the conductor layer, and a cavity;
- embedding a plurality of printhead dies in a molding material in the cavity, wherein the plurality of printhead dies are arranged end-to-end in two rows across the printed circuit board, and placement of the printhead dies is staggered such that ends of the printhead dies overlap laterally between the two rows, and wherein the molding material is level with the cover layer;
- and
- electrically connecting the printhead dies to the bond pad of the conductor layer.
1 more element
Dependencies are inferred from the claim text.