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AssigneesBoe Technology Group Co., Ltd., Beijing Boe Display Technology Co., Ltd.
InventorsJianguo Xing, Hetao Wang, Bin Yan
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A substrate structure and methods for method for attaching a flexible substrate and for peeling off a flexible substrate are disclosed. The substrate structure includes a carrier substrate and a flexible substrate disposed on the carrier substrate, the substrate structure further including a bonding layer interposed between the carrier substrate and the flexible substrate, or more than one bonding layers parallel interposed between the carrier substrate and the flexible substrate, wherein the bonding layer includes an electroviscosity layer, viscous strength of which changes under effect of electric field, the electroviscosity layer is disposed on a contact surface between the bonding layer and the flexible substrate.
A substrate structure, comprising a carrier substrate and a flexible substrate disposed on the carrier substrate, the substrate structure further comprising more than one bonding layer parallel interposed between the carrier substrate and the flexible substrate, wherein each of the more than one bonding layer comprises an electroviscosity layer, viscous strength of which changes under effect of electric field, the electroviscosity layer is disposed on a contact surface between the bonding layer and the flexible substrate.
A substrate structure comprising a carrier substrate and a flexible substrate disposed on the carrier substrate, the substrate structure further comprising more than one bonding layer parallel interposed between the carrier substrate and the flexible substrate, wherein each of the more than one bonding layer comprises an electroviscosity layer having a viscous strength which changes under effect of an electric field;
A substrate structure, comprising a carrier substrate and a flexible substrate disposed on the carrier substrate, the substrate structure further comprising a bonding layer interposed between the carrier substrate and the flexible substrate, or more than one bonding layer parallel interposed between the carrier substrate and the flexible substrate, wherein the bonding layer or each of the more than one bonding layer comprises an electroviscosity layer, viscous strength of which changes under effect of electric field, the electroviscosity layer is disposed on a contact surface between the bonding layer and the flexible substrate, wherein the bonding layer or each, of the more than one bonding layer further comprises a base and an adhesive, the base interposed between the electroviscosity layer and the adhesive, and the adhesive disposed on a contact surface between the bonding layer and the carrier substrate, and wherein the adhesive is another electroviscosity layer.
Dependencies are inferred from the claim text.