LED packaging with integrated optics and methods of manufacturing the same
AssigneeSo-Semi Technologies, LLC
InventorSteven D. Oliver
Life of this patent
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Abstract
Methods and structures are provided for wafer-level packaging of light-emitting diodes (LEDs). An array of LED die are mounted on a packaging substrate. The substrate may include an array of patterned metal contacts on a front side. The metal contacts may be in electrical communication with control logic formed in the substrate. The LEDs mounted on the packaging substrate may also be encapsulated individually or in groups and then singulated, or the LEDs mounted on the packaging substrate may be integrated with a micro-mirror array or an array of lenses.
Claims27
A method for simultaneously integrating optical elements on a plurality of light-emitting diodes (LEDs), the LEDs having a front side comprising:
- mounting a plurality of LEDs on a packaging substrate;
- after mounting, dispensing an encapsulation material onto the plurality of LEDs on the packaging substrate, the dispensed encapsulation material having a rear surface facing the LEDs and a front surface opposite the rear surface;
- simultaneously shaping the front surface of the encapsulation material over the plurality of LEDs;
- curing the encapsulation material to form encapsulations in front of the LEDs;
- and
- integrally attaching a molded mirror reflector array to the substrate to integrate the LEDs with the molded mirror reflector array prior to dispensing the encapsulation material.
A method of forming an array of LED dies on a packaging substrate, the method comprising:
- providing the packaging substrate, wherein the packaging substrate is formed from a material selected from the group consisting of one or more of Si, BeO, AlN, a thermally conductive ceramic and a thermally conductive polymer filled with micro particles for thermal properties, and the packaging substrate comprises an array of patterned metal contacts on a front side, the metal contacts being electrically connected to leads formed on one of a front side and a back side of the packaging substrate;
- mounting a plurality of pre-fabricated and singulated LED dies on the packaging substrate,
- disposing an encapsulation material onto the LED dies to encapsulate the LED dies on the packaging substrate;
- shaping the encapsulation material to simultaneously form a plurality of shaped lens profiles in front of the LED dies, wherein shaping comprises stamping the encapsulation material with a patterned stamping tool;
- and
- electrically connecting the LED dies with the metal contacts.
A method of wafer-level packaging including forming an array of LED dies on a packaging substrate, the method comprising:
- providing the packaging substrate as part of a wafer, wherein the packaging substrate comprises an array of patterned metal contacts on a front side, the metal contacts being in electrical communication with control logic formed in the wafer;
- mounting a plurality of pre-fabricated and singulated LED dies on the wafer,
- disposing an encapsulation material onto the LED dies to encapsulate the LED dies on the wafer;
- shaping the encapsulation material to simultaneously form a plurality of shaped lens profiles in front of the LED dies;
- and
- electrically connecting the LED dies with the metal contacts, wherein electrically connecting comprises connecting with a conductive bonding material.
A method of wafer-level packaging including forming an array of LED dies on a packaging substrate, the method comprising:
- providing the packaging substrate as part of a wafer, wherein the packaging substrate comprises an array of patterned metal contacts on a front side, the metal contacts being in electrical communication with control logic formed in the wafer;
- mounting a plurality of pre-fabricated and singulated LED dies on the wafer,
- disposing an encapsulation material onto the LED dies to encapsulate the LED dies on the wafer;
- shaping the encapsulation material to simultaneously form a plurality of shaped lens profiles in front of the LED dies;
- and
- electrically connecting the LED dies with the metal contacts, wherein electrically contacting comprises wirebonding.
Dependencies are inferred from the claim text.