Chemical mechanical polishing apparatus and methods

A method of polishing a substrate, comprising:

• providing a substrate in a substrate holder;
• providing a polishing platform having a moveable polishing pad;
• and
• dispensing between the polishing pad and the substrate, in a timed sequence, a first slurry component into two or more first zones and a second slurry component into one or more second zones, the first slurry component having a different chemical composition than the second slurry component with one of the first and second slurry components including an abrasive or etchant without a corrosion inhibitor and another of the first and second slurry components including a corrosion inhibitor without an abrasive and without an etchant.

A method of polishing a substrate, comprising:

• providing a plurality of individual slurry component supplies including a first slurry component supply configured to supply an oxidizer without an etchant, without an abrasive and without a corrosion inhibitor, a second slurry component supply configured to supply an abrasive or etchant without a oxidizer and without a corrosion inhibitor, and a third slurry component supply configured to supply a corrosion inhibitor without an oxidizer, without an etchant and without an abrasive;
• dispensing a first slurry component onto two or more first zones of a polishing platform via a distribution system configured to dispense the first slurry component from the plurality of individual slurry component supplies;
• and
• dispensing a second slurry component onto one or more second zones of the polishing platform via the distribution system.