Substrate processing apparatus and substrate processing method

A substrate processing method, the method comprising:

• providing a substrate processing apparatus, the substrate processing apparatus comprising a polisher, first cleaner, a second cleaner and a dryer;
• polishing a substrate using a polishing liquid by the polisher in the substrate processing apparatus;
• after that, cleaning the substrate using sulfuric acid and hydrogen peroxide water by the first cleaner;
• after that, cleaning the substrate using a basic chemical liquid and hydrogen peroxide water by the second cleaner;
• and
• after that, drying the substrate by the drier.

A substrate processing method, the method comprising:

• in a first cleaning process, cleaning, using sulfuric acid and hydrogen peroxide water, a substrate to which cerium ions are attached;
• after that, in a second cleaning process, cleaning the substrate using a basic chemical liquid and hydrogen peroxide water;
• and
• after that, in a drying process, drying the substrate.