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US 10,500,680 B2Granted
Solder alloy, solder ball, and solder joint
AssigneeSenju Metal Industry Co., Ltd.
InventorsKen Tachibana, Hikaru Nomura, Yuki Iijima, Takashi Saito, Takahiro Yokoyama, Shunsaku Yoshikawa, Naoko Izumita
Life of this patent
Estimating the term…
Abstract
A solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1% or more and less than 2.0%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.20%, Ge: 0.006 to 0.09%, and Co: 0.003% or more and less than 0.05%, and optionally Fe: 0.005 to 0.015% and P: 0.1% or less, with the balance being Sn.
Claims16
A solder alloy consisting of, in mass %:
- Bi:
- 0.1% or more and less than 2.0%;
- Cu:
- 0.1 to 1.0%;
- Ni:
- 0.01 to 0.20%;
- Ge:
- 0.006 to 0.09%;
- Co:
- 0.003% or more and less than 0.05%;
- P:
- 0.1% or less;
- and
- optionally Fe:
- 0.005 to 0.15%, with the balance being Sn, wherein
- the alloy composition satisfies the following relation (1) and relation (2):
- 72×10−6≤Ge/Sn≤920×10−6 (1)
- 0.027≤(Bi×Ge)/(Cu×Ni)≤2.4 (2)
- where in the relation (1) and the relation (2), Bi, Ge, Cu, Ni and Sn each represents a content (mass %) in the solder alloy.
16 more elements
A solder alloy consisting of, in mass %:
- Bi:
- 0.1% or more and less than 2.0%;
- Cu:
- 0.1 to 1.0%;
- Ni:
- 0.01 to 0.20%;
- Ge:
- 0.006 to 0.09%;
- and
- optionally P:
- 0.1% or less, with the balance being Sn, wherein
- the alloy composition satisfies the following relation (1) and relation (2):
- 72×10−6≤Ge/Sn≤920×10−6 (1)
- 0.027≤(Bi×Ge)/(Cu×Ni)≤2.4 (2)
- where in the relation (1) and the relation (2), Bi, Ge, Cu, Ni and Sn each represents a content (mass %) in the solder alloy.
12 more elements
Dependencies are inferred from the claim text.