Methods and apparatuses for high temperature bonding controlled processing and bonded substrates formed therefrom

A system for assessing high temperature bonding of substrates, the system comprising:

• a sintering fixture device comprising a base body comprising a metal that is at least one of copper and aluminum, a plate surface that will contact a contacting surface of a substrate assembly, wherein the substrate assembly comprises a low melting point material and one or more high melting point materials between first and second substrates, the one or more high melting point materials having a melting temperature that is higher than a melting temperature of the low melting point material, and a plurality of channels below the plate surface within the base body shaped to receive heating and cooling elements of heating and cooling systems, wherein:
• a first set of the plurality of channels includes a plurality of cross-channels, a cooling medium inlet connected to a cooling medium inlet channel, and a cooling medium outlet connected to a cooling medium outlet channel, wherein the cooling medium inlet channel and the cooling medium outlet channel are aligned in a channel plane, and the plurality of cross-channels, the cooling medium inlet, and the cooling medium outlet are in fluid communication with one another, the plurality of cross-channels are spaced apart and non-intersecting,
• a second set of the plurality of channels includes a plurality of heating element passageways, and
• the sintering fixture device comprises a pair of legs defining a recess therebetween, the pair of legs extending from the base body on a side opposite the plate surface, wherein each leg of the pair of legs comprises an outer sidewall comprising a plurality of fastener apertures aligned on a fastener plane that is co-aligned with the channel plane, the plurality of fastener apertures for receipt of fasteners to mount the sintering fixture device to a pair of brackets coupled to an underlying surface aligned with the fastener plane such that the recess is spaced from the underlying surface when each leg is mounted to each bracket to improve a thermal contact between the substrate assembly and the plate surface during high temperature bonding;
• the substrate assembly disposed on the plate surface of the sintering fixture device;
• a processor;
• and
• a non-transitory computer-readable storage medium in communication with the processor, the non-transitory computer-readable storage medium including one or more programming instructions executable by the processor to cause the processor to:
• control heating elements associated with the second set of the plurality of channels of the sintering fixture device and a flow of a cooling fluid through the first set of the plurality of channels of the sintering fixture device to achieve a process temperature profile to form a bond layer between the first and second substrates.