Power module, thermal dissipation structure of the power module and contact method of the power module

A thermal dissipation structure of a power module, the thermal dissipation structure comprising:

• a semiconductor device;
• a heat radiation plate to which the semiconductor device is contacted;
• a sealing body configured to seal a perimeter of the semiconductor device so as to expose at least one portion of the heat radiation plate;
• first and second power terminals and an output terminal connected to an electrode of the semiconductor device, the first and second power terminals and the output terminal exposed from opposite side surfaces of the sealing body, each of the first and second power terminals and the output terminal being exposed at a height different from a height of an exposed surface of the heat radiation plate of the sealing body, each of the first and second power terminals and the output terminal being exposed at a height different from a height of a surface of the sealing body opposite to the exposed surface of the heat radiation plate of the sealing body;
• a cooling plate to which the heat radiation plate exposed from the sealing body is contacted via a thermally-conductive material, the cooling plate facing the heat radiation plate;
• a regulating portion formed on the sealing body, the regulating portion configured to regulate a thickness of the thermally-conductive material so as to become uniform and
• a protruding portion for positioning protruding from a center portion of the regulating portion, wherein
• the regulating portion is a square-shaped or circle-shaped convex region which is disposed so as to surround a periphery of the heat radiation plate,
• the convex region is configured to form a spatial area to be embedded with a predetermined quantity of the thermally-conductive material on the exposed surface of the heat radiation plate,
• the convex region comprises a discharge groove configured to discharge excessive amounts of the thermally-conductive material in the spatial area to an outside of the spatial area, and
• a diameter of the protruding portion for positioning is smaller than a diameter of a thickness of the regulating portion.