US 10,485,118 B2 · Multi-part flexible encapsulation housing for electronic devices and methods of making the same

Abstract

Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

Claims24

Dependent claims

A conformal integrated circuit (IC) device comprising:

a flexible substrate;
an electronic circuitry attached to the flexible substrate;
and
a flexible multi-part encapsulation housing at least substantially encasing therein the electronic circuitry and the flexible substrate, the multi-part encapsulation housing including a first encapsulation housing component attached to a second encapsulation housing component, the first encapsulation housing component having at least one first recessed region for seating therein the electronic circuitry, and the second encapsulation housing component having at least one second recessed region for seating therein the flexible substrate,
wherein the electronic circuitry includes a plurality of device islands and a plurality of stretchable electrical interconnects electrically connecting two or more of the device islands.

2 more elements

Dependencies are inferred from the claim text.

Multi-part flexible encapsulation housing for electronic devices and methods of making the same

Life of this patent

Multi-part flexible encapsulation housing for electronic devices and methods of making the same

Life of this patent

Abstract

Claims24