Electrical connection method of printed circuit and electrical connection structure of printed circuit
AssigneeYazaki Corporation
InventorsMizuki Shirai, Hiroki Kondo
Life of this patent
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Abstract
An electrical connection method of a printed circuit includes overlapping a base material and a thin member in which a thin conductor is mounted, forming a through hole which passes through the base material overlapped with the thin member in the overlapping and reaches the thin conductor of the thin member, and forming a printed circuit on the base material by a screen printing method using conductive paste. The through hole formed in the forming of the through hole is filled with the conductive paste in the forming of the printed circuit.
Claims2
An electrical connection method of a printed circuit, comprising:
- overlapping a base material and a thin member in which a thin conductor is mounted;
- forming a through hole which passes through the base material overlapped with the thin member, and reaches the thin conductor of the thin member;
- and
- forming the printed circuit on the base material by a screen printing method using conductive paste,
- wherein the through hole is filled with the conductive paste in the forming of the printed circuit,
- wherein the thin member is a flat shield cable covered with a shield member except one portion of the thin member,
- wherein in the forming of the through hole, a first through hole is formed to pass through the base material overlapped in the overlapping and to open the one portion of the thin member so as to reach the thin conductor, and a second through hole is formed to pass through the base material overlapped in the overlapping to reach the shield member, and
- wherein in the forming of the printed circuit, the first through hole is filled with the conductive paste when a signal line is formed as a first printed circuit on the base material, and the second through hole is filled with the conductive paste when a ground line is formed as a second printed circuit on the base material at the same time as the signal line is formed.
Dependencies are inferred from the claim text.