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US 10,485,092 B2Granted
Multilayer bus board
AssigneeInterplex Industries, Inc.
InventorsRichard Schneider, Joseph J. Lynch
Life of this patent
Estimating the term…
Abstract
A multilayer bus board comprising a multilayer stacked assembly including a plurality of electrically conductive first layers, and at least one second dielectric layer disposed between adjacent first layers; and a frame formed of a dielectric material, the frame encapsulating at least a portion of the multilayer stacked assembly and mechanically maintaining the first and second layers in secure aligned abutting relation.
Claims20
A multilayer bus board comprising:
- a multilayer stacked assembly having a plurality of layers including a pair of electrically conductive layers and a dielectric layer disposed between and adjoining each of the conductive layers;
- and
- a molded frame formed of an insulating polymer material, the frame having a peripheral portion encapsulating end portions of the dielectric layer and the conductive layers to maintain the conductive layers and the dielectric layer in position relative to each other, the frame defining an enlarged opening through which an external surface of an outer one of the layers is exposed.
Dependencies are inferred from the claim text.