Routing-over-void-T-line-compensation
AssigneeIntel Corporation
InventorsKhang Choong Yong, Bok Eng Cheah, Jackson Chung Peng Kong, Stephen Harvey Hall, Yun Rou Lim
Life of this patent
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AssigneeIntel Corporation
InventorsKhang Choong Yong, Bok Eng Cheah, Jackson Chung Peng Kong, Stephen Harvey Hall, Yun Rou Lim
Estimating the term…
Apparatus and methods are provided for ameliorating distortion issues associated with a conductor that passes over a void in a reference plane. In an example, the signal conductor can include a first part routed over the major surface of a first side of the reference plane structure on a first side of the void and that approaches a first edge of the reference plane structure with a first trajectory, a second part routed over the major surface of the reference plane structure on a second side of the void and that approaches a second edge of the reference plane structure with a second trajectory, and a third portion connecting the first portion with the second portion, the third portion spanning the void, and having a plurality of spurs extending from a body of the third portion.
An apparatus comprising:
A system comprising:
Dependencies are inferred from the claim text.