Temperature instability-aware circuit
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Hui Chen, Wan-Yen Lin, Tsung-Hsin Yu
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Hui Chen, Wan-Yen Lin, Tsung-Hsin Yu
Estimating the term…
A circuit includes: a first type of swing reduction circuit coupled between an input/output pad and a buffer circuit; and a second type of swing reduction circuit coupled between the input/output pad and the buffer circuit, wherein the first type of swing reduction circuit is configured to increase a voltage received by respective gates of a first subset of transistors of the buffer circuit when a voltage applied on the input/output pad is equal to a first supply voltage, and the second type of swing reduction circuit is configured to reduce a voltage received by respective gates of a second subset of transistors of the buffer circuit when the voltage applied on the input/output pad is equal to a second supply voltage.
A circuit, comprising:
A circuit, comprising:
A method, comprising:
Dependencies are inferred from the claim text.