Wearable power management system

A wearable power management system comprising:

• a bottom coating layer;
• a bottom center layer disposed above the bottom coating layer;
• a circuit layer disposed above the bottom center layer;
• a top center layer disposed above the circuit layer;
• and
• a top coating layer disposed above the top center layer;
• wherein:
• the Young's modulus of both the bottom center layer and the top center layer is in the range of 2.5 kPa-4.5 kPa and the thickness of both the bottom center layer and the top center layer is in the range of 250 um-350 um;
• the Young's modulus of both the bottom coating layer and the top coating layer is in the range of 50 kPa-70 kPa and the thickness of both the bottom coating layer and the top coating layer is in the range of 250 um-350 um;
• the circuit layer comprises a device layer and a connection layer disposed above the device layer;
• the device layer comprises a device matrix and alloy connection wires, the device matrix comprising a plurality of cells and a plurality of rechargeable batteries;
• odd rows of the device matrix comprise a plurality of solar cells;
• even rows of the device matrix comprise a plurality of rechargeable batteries;
• the solar cells are composite semiconductor solar cells with thickness between 30 um-40 um;
• the rechargeable batteries are lithium-ion chip cells y with thickness between 180 um-220 um;
• the alloy connection wires are connected and conducting between the device layer and the connection layer, and made of indium silver alloy;
• the connection layer comprises a connection wire network, the connection wire network comprising a plurality of connection wires and overlapping with the device matrix;
• each device in the device matrix is connected to an adjacent device in the device matrix through the alloy connection wires and the connection wires of the connection network;
• the connection wires essentially have a shape of sine waveforms;
• and
• the connection layer comprises:
• a first polyimide layer;
• a copper layer disposed above the first polyimide layer;
• and
• a second polyimide layer disposed above the copper layer.