Methods of making moisture-resistant downhole electrical feedthroughs

A method of forming a downhole electrical feedthrough package, the method comprising:

• combining at least two of the four components selected from Bi2O3, B2O3, MO, and optionally REO to form a glass mixture;
• heating the glass mixture to approximately 650 to 1400 degrees Celsius;
• quenching the heated glass mixture in de-ionized water bath to form glass frits;
• sintering the glass frits with hollow cylinder shape and fitted into a conduit of a metal shell to form an electrical feedthrough assembly;
• firing the electrical feedthrough assembly at first temperature (T1) for a first time period to form a dielectric seal and to provide a first thermal energy to the dielectric seal;
• heating the electrical feedthrough assembly at second temperature (T2) for a second time period to provide a second thermal energy to the dielectric seal;
• cooling the dielectric seal of the electrical feedthrough assembly to ambient temperature for a third time period;
• and
• integrating two isolators into the conduit so that the dielectric seal is in contact with at least one of the isolators.