Semiconductor package and manufacturing method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsSeung Wook Park, Tah Joon Park, Jae Hyun Jung, Hwa Sun Lee, Seong Hun Na
Life of this patent
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Abstract
A semiconductor package includes a lower package including at least one electronic device, and an antenna unit disposed on an upper surface of the lower package, wherein the antenna unit includes: a ground portion disposed on an upper surface of the lower package, a radiating portion disposed to be spaced apart from the ground portion, and a support portion separating the radiating portion and the ground portion, and at least a portion between the radiating portion and the grounding portion is empty space.
Claims14
A semiconductor package comprising:
- a lower package comprising one or more electronic devices;
- and
- an antenna unit disposed on an upper surface of the lower package,
- wherein the antenna unit includes:
- a ground portion disposed on an upper surface of the lower package;
- a radiating portion comprising one or more radiators disposed to be spaced apart from the ground portion;
- and
- a support portion separating the radiating portion and the ground portion,
- wherein at least a portion between the radiating portion and the ground portion is empty space.
A semiconductor package comprising:
- a lower package comprising one or more electronic devices disposed on a substrate and a sealing portion sealing the electronic device;
- and
- an antenna unit disposed on an upper surface of the sealing portion,
- wherein the antenna unit comprises:
- a ground portion disposed on an upper surface of the lower package;
- a radiating portion disposed spaced apart from the ground portion;
- and
- a connection portion disposed on a side surface of the sealing portion and electrically connecting the antenna unit and the substrate.
Dependencies are inferred from the claim text.