Electronic device having display with thin-film encapsulation

An electronic device, comprising:

• an organic light-emitting diode display having:
• a glass substrate that forms an inner encapsulation layer;
• a thin-film encapsulation layer that forms an outer encapsulation layer;
• a layer of thin-film transistor circuitry interposed between the inner and outer encapsulation layers, wherein the layer of thin-film transistor circuitry includes transistors and organic light-emitting diodes and is configured to form a pixel array that displays images;
• a quarter wave plate;
• and
• a birefringent compensation film interposed between the quarter wave plate and the thin-film encapsulation layer;
• a housing in which the organic light-emitting diode display is mounted;
• display driver circuitry in the housing;
• and
• a flexible path that couples the display driver circuitry to the organic light-emitting diode display.

An electronic device having opposing front and rear faces, comprising:

• a housing having a rear wall on the rear face;
• an organic light-emitting diode display coupled to the housing on the front face, wherein the organic light-emitting diode display comprises:
• a display cover layer that covers the front face;
• a glass substrate;
• a layer of thin-film transistor circuitry on the glass substrate that includes transistors and organic light-emitting diodes and that is configured to form a pixel array that displays images through the display cover layer;
• and
• a thin-film encapsulation layer, wherein the layer of thin-film transistor circuitry is interposed between the glass substrate and the thin-film encapsulation layer, wherein the thin-film encapsulation layer has a thickness of less than 10 microns.