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US 10,483,490 B2Granted
OLED panel, method for manufacturing the same and display device
AssigneeBoe Technology Group Co., Ltd.
InventorsChunjan Wang, Huaiting Shih
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Abstract
The present disclosure discloses an OLED panel, a method for manufacturing the same and a display device. The OLED panel includes a substrate, a cover plate, an OLED device and an encapsulation structure. The encapsulation structure includes a thin-film encapsulation layer and an encapsulation adhesive, and a hydrochromic material is added in the encapsulation structure.
Claims13
An organic light emitting diode (OLED) panel, comprising:
- a substrate;
- a cover plate, arranged opposite to the substrate;
- an OLED device, arranged on the substrate;
- and
- an encapsulation structure, arranged between the substrate and the cover plate;
- wherein the encapsulation structure comprises a thin-film encapsulation layer and an encapsulation adhesive;
- a side of the OLED device, which is away from the substrate, is covered with the thin-film encapsulation layer;
- and a hydrochromic material is added in the thin-film encapsulation layer and/or the encapsulation adhesive;
- and
- wherein the hydrochromic material is CuSO4 whose color changes when it is in contact with water;
- and
- wherein the encapsulation adhesive comprises a first encapsulation adhesive, a second encapsulation adhesive and a third encapsulation adhesive;
- and
- a side of the thin film encapsulation layer, which is away from the substrate, is covered with the first encapsulation adhesive;
- the second encapsulation adhesive, in which the hydrochromic material is added, surrounds the first encapsulation adhesive;
- and
- the third encapsulation adhesive surrounds the second encapsulation adhesive and prevent the second encapsulation adhesive from being in contact with water vapor.
14 more elements
An organic light emitting diode (OLED) panel, comprising:
- a substrate;
- a cover plate, arranged opposite to the substrate;
- an OLED device, arranged on the substrate;
- and
- an encapsulation structure, arranged between the substrate and the cover plate;
- wherein the encapsulation structure comprises a thin-film encapsulation layer and an encapsulation adhesive;
- a side of the OLED device, which is away from the substrate, is covered with the thin-film encapsulation layer;
- and a hydrochromic material is added in the thin-film encapsulation layer and/or the encapsulation adhesive;
- wherein the hydrochromic material is CuSO4 whose color changes when it is in contact with water, and
- wherein
- the thin-film encapsulation layer is formed at the side of the OLED device which is away from the substrate, and comprises a multi-layer structure formed by inorganic encapsulation layers and organic encapsulation layers which are alternately arranged in order in a direction away from the OLED device, the total number of the inorganic encapsulation layers and organic encapsulation layers is at least three, and the hydrochromic material is added in at least one organic encapsulation layer;
- and
- a side of the thin-film encapsulation layer, which is away from the substrate, is covered with the encapsulation adhesive which prevents the thin-film encapsulation layer from being in contact with water vapor.
10 more elements
A method for manufacturing an organic light emitting diode (OLED) panel, comprising steps of:
- providing a substrate and a cover plate;
- forming an OLED device on the substrate;
- forming an encapsulation structure on the substrate, wherein the encapsulation structure comprises a thin-film encapsulation layer and an encapsulation adhesive, a side of the OLED device, which is away from the substrate, is covered with the thin-film encapsulation layer, and a hydrochromic material is added in the thin-film encapsulation layer and/or the encapsulation adhesive;
- and
- aligning the cover plate with the substrate provided with the OLED device and the encapsulation structure, attaching the cover plate on the substrate, and curing the encapsulation adhesive with ultraviolet light, to form the OLED panel,
- wherein the hydrochromic material is CuSO4 whose color changes when it is in contact with water, and
- wherein the step of forming the encapsulation structure comprises:
- forming the thin-film encapsulation layer on the side of the OLED device which is away from the substrate;
- forming a first encapsulation adhesive on a side of the thin-film encapsulation layer which is away from the OLED device;
- forming a second encapsulation adhesive which surrounds the first encapsulation adhesive, wherein the hydrochromic material is added in the second encapsulation adhesive;
- and
- forming a third encapsulation adhesive which surrounds the second encapsulation adhesive, to prevent the second encapsulation adhesive from being in contact with water vapor.
9 more elements
Dependencies are inferred from the claim text.