Electronic device

An electronic device comprising a carrier and a semiconductor chip,

• wherein the carrier comprises a first dielectric layer and a second dielectric layer,
• a thermal conductivity of the first dielectric layer exceeds a thermal conductivity of the second dielectric layer,
• the second dielectric layer is arranged on the first dielectric layer and partially covers the first dielectric layer,
• the semiconductor chip is arranged on the carrier in a mounting area in which the first dielectric layer is not covered by the second dielectric layer,
• the carrier comprises a solder terminal for electrical contacting arranged on the second dielectric layer,
• the carrier comprises a contact layer arranged on the second dielectric layer,
• the carrier comprises a covering layer directly adjoining the contact layer and partially covering the contact layer,
• and the solder terminal is provided by a region of the contact layer which is not covered by the covering layer.

An electronic device comprising a carrier and a semiconductor chip,

• wherein the carrier comprises a first dielectric layer and a second dielectric layer,
• each of the first and the second dielectric layer is made of a resin-based composite material,
• a thermal conductivity of the first dielectric layer exceeds a thermal conductivity of the second dielectric layer,
• the second dielectric layer is arranged on the first dielectric layer and partially covers the first dielectric layer,
• the semiconductor chip is arranged on the carrier in a mounting area in which the first dielectric layer is not covered by the second dielectric layer, and
• the carrier comprises a solder terminal for electrical contacting arranged on the second dielectric layer.