Optical semiconductor component package and optical semiconductor device
AssigneeKYOCERA Corporation
InventorsMasahiko Taniguchi, Hidenobu Egashira
Life of this patent
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Abstract
An optical semiconductor component package includes a base, a frame, a lid, and a light absorbing member located on an inner surface of the lid. The base is plate-like and has a first surface including a mount area in which an optical semiconductor component is mountable. The frame is located on the first surface and surrounds the mount area. The lid is plate-like and is bonded to the frame and covers the mount area. The light absorbing member is located on a second surface of the lid facing the mount area, and has a plurality of recesses on its surface.
Claims12
An optical semiconductor component package, comprising:
- a plate-like base having a first surface including a mount area in which an optical semiconductor component is mountable;
- a frame located on the first surface and surrounding the mount area;
- a plate-like lid bonded to the frame and covering the mount area;
- and
- a light absorbing member located on a second surface of the lid facing the mount area, the light absorbing member having a plurality of recesses on a surface thereof.
Dependencies are inferred from the claim text.