Back to results
US 10,483,355 B2Granted
Forming non-line-of-sight source drain extension in an NMOS FINFET using n-doped selective epitaxial growth
AssigneeApplied Materials, Inc.
InventorsMatthias Bauer, Hans-Joachim L. Gossmann, Benjamin Colombeau
Life of this patent
Estimating the term…
Abstract
A finFET device includes an n-doped source and/or drain extension that is disposed between a gate spacer of the finFET and a bulk semiconductor portion of the semiconductor substrate on which the n-doped source or drain extension is disposed. The n-doped source or drain extension is formed by a selective epitaxial growth (SEG) process in a cavity formed proximate the gate spacer.
Claims11
A finFET device, comprising:
- a semiconductor substrate having a bulk semiconductor region;
- a semiconductor fin structure that is disposed on the bulk semiconductor region, the semiconductor fin structure comprising:
- a source extension region epitaxially grown on the bulk semiconductor region, the source extension region comprising a first n-type dopant;
- a drain extension region epitaxially grown on the bulk semiconductor region, the drain extension region comprising the first n-type dopant;
- a first carbon-containing layer that is surrounded by the source extension region and not in direct contact with the bulk semiconductor region;
- a second carbon-containing layer that is surrounded by the drain extension region and not in direct contact with the bulk semiconductor region;
- a source region comprising a second n-type dopant, wherein the source region is surrounded by the first carbon-containing layer and not in direct contact with the bulk semiconductor region;
- a drain region comprising the second n-type dopant, wherein the drain region is surrounded by the second carbon-containing layer and not in direct contact with the bulk semiconductor region;
- and
- a channel region between the source extension region and the drain extension region;
- and
- a gate electrode structure that is formed on a portion of the semiconductor fin structure, the gate electrode structure comprising:
- a gate electrode layer;
- a first gate spacer formed on a first sidewall of the gate electrode layer and on the source extension region;
- and
- a second gate spacer formed on a second sidewall of the gate electrode layer and on the drain extension region wherein
- the first n-type dopant is different than the second n-type dopant,
- the first n-type dopant in the source extension region prevents diffusion of the second n-type dopant in the source region to the channel region, and
- the first n-type dopant in the drain extension region prevents diffusion of the second n-type dopant in the drain region to the channel region.
16 more elements
A nanowire structure, comprising:
- a semiconductor substrate having a bulk semiconductor region;
- a first silicon-germanium (SiGe) layer that is disposed on the bulk semiconductor region, the first silicon-germanium (SiGe) layer comprising a first silicon-germanium (SiGe) portion and a first internal spacer structure;
- and
- a first silicon (Si) layer that is formed on the first silicon-germanium (SiGe) layer, the first silicon (Si) layer comprising a first silicon (Si) portion that is in direct contact with the first silicon-germanium (SiGe) portion and a first arsenic-doped silicon (Si:As) portion that is formed via a selective epitaxial growth (SEG) within a cavity of the first internal spacer structure.
1 more element
A nanosheet structure, comprising:
- a semiconductor substrate having a bulk semiconductor region;
- a silicon-germanium (SiGe) layer that is disposed on the bulk semiconductor region, the silicon-germanium (SiGe) layer comprising a silicon-germanium (SiGe) portion and an internal spacer structure;
- and
- a silicon (Si) layer that is formed on the silicon-germanium (SiGe) layer, the silicon (Si) layer comprising a silicon (Si) portion that is in direct contact with the silicon-germanium (SiGe) portion and an arsenic-doped silicon (Si:As) portion that is formed via a selected epitaxial growth (SEG) within a cavity of the internal spacer structure.
1 more element
Dependencies are inferred from the claim text.