Inductors for chip to chip near field communication

A device comprising:

• a first inductor positioned on a first substrate, the first substrate having at least one major surface defining a first horizontal plane, the first inductor having a plurality of turns about a first horizontal axis parallel to the first horizontal plane;
• and
• a second inductor positioned on a second substrate, the second substrate having at least one major surface defining a second horizontal plane, the second inductor having at least one turn about a second horizontal axis parallel to the second horizontal plane, the first and second horizontal planes being substantially parallel to each other;
• wherein the first and second inductors are designed to be inductively coupled to each other;
• a first turn of the plurality of turns of the first inductor comprises a plurality of segments positioned in a plurality of metal layers of the first substrate, each segment being electrically connected to a subsequent segment by a via, a first such segment being a first end segment and a last such segment being a second end segment;
• at least two of the plurality of segments being displaced along the first horizontal axis relative to a prior segment such that a projection of the first end segment onto the first horizontal axis does not overlap with a projection of the second end segment onto the first horizontal axis;
• and
• a second turn of the plurality of turns of the first inductor has a first end segment connected to the second end segment of the first turn.