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US 10,483,308 B2Granted
Reducing thickness of module in solid state imaging device
AssigneeSony Corporation
InventorMasayuki Ishikida
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes: a sheet-like thin plate on which a semiconductor chip is secured; and a substrate including a wiring layer, disposed on the thin plate to extend over a part of a region surrounding the region where the semiconductor chip is secured or over the entire surrounding region, wherein the semiconductor chip and the substrate are electrically connected.
Claims18
A camera module, comprising:
- a metal plate;
- an image sensor on the metal plate;
- a wiring substrate on the metal plate, wherein
- the wiring substrate includes a plurality of wiring layers,
- the wiring substrate comprises one of a ceramic material or organic material,
- the metal plate comprises copper,
- the metal plate has no wiring layer of the plurality of wiring layers,
- the wiring substrate is in contact with the metal plate,
- the wiring substrate extends entirely over a first region of the metal plate that surrounds a second region of the metal plate,
- the image sensor is on the second region,
- the image sensor is electrically connected to the wiring substrate,
- the wiring substrate includes a first edge and a second edge, and
- the wiring substrate is on the metal plate such that a width between the first edge and the second edge of the wiring substrate is equal to a width of the metal plate in a sectional view;
- and
- a lens unit on the wiring substrate.
12 more elements
An electronic apparatus, comprising:
- a camera module that comprises:
- a metal plate;
- an image sensor on the metal plate;
- a wiring substrate on the metal plate, wherein
- the wiring substrate includes a plurality of wiring layers,
- the wiring substrate comprises one of a ceramic material or organic material,
- the metal plate comprises copper,
- the metal plate has no wiring layer of the plurality of wiring layers,
- the wiring substrate is in contact with the metal plate,
- the wiring substrate extends entirely over a first region of the metal plate that surrounds a second region of the metal plate,
- the image sensor is on the second region,
- the image sensor is electrically connected to the wiring substrate,
- the wiring substrate includes a first edge and a second edge, and
- the wiring substrate is on the metal plate such that a width between the first edge and the second edge of the wiring substrate is equal to a width of the metal plate in a sectional view;
- and
- a lens unit on the wiring substrate.
13 more elements
Dependencies are inferred from the claim text.