EEPROM device

An electronic device comprising a semiconductor device and an electronic component connected to the semiconductor device, wherein the semiconductor device comprises:

• a semiconductor substrate;
• a first dielectric layer having a first thickness on the semiconductor substrate;
• a first opening having a first width in the first dielectric layer;
• a second dielectric layer having a second thickness disposed in a middle region of the first opening;
• and
• a third dielectric layer having a first portion and a second portion disposed on opposite sides of second dielectric layer, the first portion and the second portion having a second width smaller than the first width, and the third dielectric layer having a third thickness smaller than the first thickness and the second thickness.