Electronic module and semiconductor package device
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorChang-Lin Yeh
Life of this patent
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Abstract
An electronic module includes a first sub-module and a second sub-module. The first sub-module includes a first substrate, a first electronic component disposed on the first substrate and a first electrode. The second sub-module includes a second substrate, a second electronic component disposed on the second substrate and a second electrode spaced from the first electrode. The second electrode faces the first electrode to form a capacitor for transmitting an alternating current (AC) signal between the first sub-module and the second sub-module.
Claims18
An electronic module, comprising:
- a first sub-module including a first substrate, a first electronic component disposed on the first substrate and a first electrode;
- and
- a second sub-module including a second substrate, a second electronic component disposed on the second substrate and a second electrode spaced from the first electrode,
- wherein the second electrode faces the first electrode to form a capacitor for transmitting an alternating current (AC) signal between the first sub-module and the second sub-module,
- the first sub-module further comprises a converter configured to convert a first direct current (DC) signal to a converted AC signal and to transmit the converted AC signal to the second sub-module through AC coupling between the first electrode of the first sub-module and the second electrode of the second sub-module;
- and
- the second sub-module further comprises a converter configured to covert the converted AC signal to a second DC signal.
A semiconductor package device, comprising:
- a substrate including a first surface and a second surface opposite to the first surface;
- a first electronic component disposed on the first surface of the substrate;
- a first package body disposed on the first surface of the substrate and covering the first electronic component;
- a first electrode disposed on a first lateral surface of the first package body, wherein the first electrode is configured to form an electrode of a capacitor to transmit or receive an alternating current (AC) signal;
- and
- a second electrode disposed on a top surface of the first package body and a second lateral surface of the first package body opposite to the first lateral surface of the first package body, wherein the second electrode is configured to form an electrode of a capacitor to transmit or receive an AC signal.
A flexible electronic module, comprising:
- a first sub-module including a first electronic component and a first electrode electrically connected to the first electronic component;
- and
- a second sub-module including a second electronic component and a second electrode electrically connected to the second electronic component;
- and
- a band covering the first sub-module and the second sub-module,
- wherein an alternating current (AC) signal is transmitted between the first electrode of the first sub-module and the second electrode of the second sub-module through AC coupling,
- the first sub-module further comprises a converter configured to convert a first direct current (DC) signal to a converted AC signal and to transmit the converted AC signal to the second sub-module through AC coupling between the first electrode of the first sub-module and the second electrode of the second sub-module;
- and
- the second sub-module further comprises a converter configured to covert the converted AC signal to a second DC signal.
Dependencies are inferred from the claim text.