Three-dimensional small form factor system in package architecture

An electronic device comprising:

• a stacked system in package (SiP), the stacked system in package including:
• a first package including a plurality of embedded electronic components and one or more via bars, ones of the plurality of embedded electronic components laterally adjacent to one another, each via bar including a plurality of through vias, the first package having a first side and an opposite second side, and
• a second package including a plurality of embedded electronic components, ones of the plurality of embedded electronic components laterally adjacent to one another, the second package having a first side and an opposite second side;
• and
• a main printed circuit board (PCB), the first package being coupled with the main PCB;
• wherein the stacked system in package includes a receiver, a transmitter, or both, and wherein the electronic device includes one or more antennas including a dipole antenna for the transmission of data;
• and
• wherein a first side of the first package and a second side of second package are coupled together by a plurality of connections, including at least a first connection connecting the second package to a first component of the first package and a second connection connecting one of the plurality of embedded electronic components of the second package to a first via bar of the one or more via bars, wherein the one of the plurality of embedded electronic components of the second package is directly over the first via bar of the one of the one or more embedded via bars of the first package.

A method comprising:

• placing a plurality of electronic components and one or more via bars on a mold carrier to form a wafer for a first package, ones of the plurality of embedded electronic components laterally adjacent to one another;
• overmolding the wafer for the first package to embed the electronic components and one or more via bars using a mold compound;
• releasing the mold carrier for the first package;
• thinning the mold compound of the wafer of the first package to expose connections of the via bars and a first electronic component on a top side of the first package;
• and
• applying a second package on the connections of the first electronic component and the via bars of the first package to form a stacked package, the second package comprising a plurality of embedded electronic components, ones of the plurality of embedded electronic components laterally adjacent to one another, wherein one of the plurality of embedded electronic components of the second package is directly over and connected to one of the one or more via bars of the first package.