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US 10,483,249 B2Granted
Integrated passive devices on chip
AssigneeIntel Corporation
InventorsDonald S. Gardner, Edward A. Burton, Gerhard Schrom, Larry E. Mosley
Life of this patent
Estimating the term…
Abstract
Embodiments are generally directed to integrated passive devices on chip. An embodiment of a device includes a semiconductor die; a semiconductor die package, a first side of the package being coupled with the semiconductor die; and one or more separate dies to provide passive components for operation of the semiconductor die, wherein the passive components for operation of the semiconductor die includes inductors.
Claims24
A device comprising:
- a semiconductor die;
- a semiconductor die package, a first side of the package being coupled with the semiconductor die;
- and
- one or more separate dies to provide a plurality of passive components for operation of the semiconductor die, wherein the plurality of passive components for operation of the semiconductor die includes a plurality of inductors and a plurality of capacitors, and wherein a first separate die includes a first set of passive components on a first side of the first separate die and a second, different set of passive components on a second, opposite side of the first separate die.
1 more element
A method comprising:
- fabricating one or more separate dies, the one or more separate dies including a plurality of passive components;
- coupling a first side of a semiconductor die package with a semiconductor die;
- and
- coupling the one or more separate dies with the semiconductor die package to provide passive components for operation of the semiconductor die;
- wherein the plurality of passive components includes one or more inductors and a plurality of capacitors;
- and
- wherein fabricating the one or more separate dies includes fabricating a first separate die with a first set of passive components on a first side of the first separate die and a second, different set of passive components on a second, opposite side of the first separate die.
4 more elements
A system comprising:
- a system on chip;
- a semiconductor die package, a first side of the package being coupled with the system on chip;
- one or more separate dies to provide a plurality of passive components for operation of the system on chip, a first side of each of the one or more separate dies being coupled to a second, opposite side of semiconductor die package;
- a mother board, the motherboard being coupled with the second side of the semiconductor die package and a second, opposite side of each of the one or more separate dies, the one or more separate dies being between the semiconductor die package and the motherboard;
- wherein the plurality of passive components includes a plurality of inductors, wherein the one or more separate dies further include one or more high voltage transistors.
2 more elements
A device comprising:
- a semiconductor die;
- a semiconductor die package, a first side of the package being coupled with the semiconductor die;
- and
- one or more separate dies to provide a plurality of passive components for operation of the semiconductor die, wherein the one or more separate dies further include one or more high voltage transistors, and wherein the plurality of passive components for operation of the semiconductor die includes a plurality of inductors.
1 more element
A device comprising:
- a semiconductor die;
- a semiconductor die package, a first side of the package being coupled with the semiconductor die;
- one or more separate dies to provide a plurality of passive components for operation of the semiconductor die, wherein the plurality of passive components for operation of the semiconductor die includes a plurality of inductors;
- and
- an interposer between the semiconductor die and the semiconductor die package, wherein the one or more separate dies are embedded inside the interposer.
2 more elements
A method comprising:
- fabricating one or more separate dies, the one or more separate dies including a plurality of passive components;
- coupling a first side of a semiconductor die package with a semiconductor die;
- and
- coupling the one or more separate dies with the semiconductor die package to provide passive components for operation of the semiconductor die, wherein the one or more separate dies further include one or more high voltage transistors, and wherein the plurality of passive components includes one or more inductors.
1 more element
Dependencies are inferred from the claim text.