Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias
AssigneeSkyworks Solutions, Inc.
InventorsJiro Yota, Hong Shen, Viswanathan Ramanathan
Life of this patent
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Abstract
An electronics package includes a semiconductor substrate having one or more passive devices formed thereon and a cavity defined in a first surface thereof. A piezoelectric substrate is bonded to the semiconductor substrate and has a radio frequency (RF) filter formed thereon. The RF filter is disposed within the cavity defined in the semiconductor substrate.
Claims22
An electronics package comprising:
- a semiconductor substrate having one or more passive devices formed on the semiconductor substrate and a cavity defined in a first surface of the semiconductor substrate;
- and
- a piezoelectric substrate bonded to the semiconductor substrate and having a microelectromechanical device formed on the piezoelectric substrate, the microelectromechanical device disposed within the cavity defined in the semiconductor substrate.
A module for an electronic device including an electronics package, the electronics package comprising:
- a semiconductor substrate having one or more passive devices formed on the semiconductor substrate and a cavity defined in a first surface of the semiconductor substrate;
- and
- a piezoelectric substrate bonded to the semiconductor substrate and having a microelectromechanical device formed on the piezoelectric substrate, the microelectromechanical device disposed within the cavity defined in the semiconductor substrate.
An electronic device including a module for an electronic device, the module including an electronics package, the electronics package comprising:
- a semiconductor substrate having one or more passive devices formed on the semiconductor substrate and a cavity defined in a first surface of the semiconductor substrate;
- and
- a piezoelectric substrate bonded to the semiconductor substrate and having a microelectromechanical device formed on the piezoelectric substrate, the microelectromechanical device disposed within the cavity defined in the semiconductor substrate.
Dependencies are inferred from the claim text.