Semiconductor device and method for manufacturing the same
AssigneesTohoku University, Toshiba Memory Corporation
InventorsMitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, Kang-Wook Lee
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AssigneesTohoku University, Toshiba Memory Corporation
InventorsMitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, Kang-Wook Lee
Estimating the term…
A semiconductor device includes a metal column that extends in a stretching direction; a polymer layer that surrounds the metal column from a direction crossing the stretching direction; and a guide that surrounds the polymer layer in the crossing direction so as to be spaced from the metal column with the polymer layer interposed therebetween. A method for manufacturing semiconductor devices includes a step of filling a mixture containing metal particles and polymers in a guide; and a step of subjecting the mixture to a heat treatment so that the polymers agglomerate to the guide to form a polymer layer that makes contact with the guide and the metal particles agglomerate away from the guide with the polymer layer interposed therebetween to form a metal column that stretches in a stretching direction of the guide from the metal particles.
A method for manufacturing semiconductor devices comprising:
A method for manufacturing semiconductor devices comprising:
A method for manufacturing semiconductor devices comprising:
Dependencies are inferred from the claim text.