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US 10,483,230 B2Granted
Bonding package components through plating
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsZheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu
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Abstract
A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
Claims19
A package comprising:
- a first package component comprising a first electrical connector, wherein the first electrical connector comprises a first sidewall surface;
- a second package component comprising a second electrical connector, wherein the second electrical connector comprises a second sidewall surface;
- and
- a metal layer formed of a non-solder metallic material, the metal layer comprising:
- a first portion on the first sidewall surface;
- a second portion on the second sidewall surface, wherein the first portion is continuously connected to the second portion, and the first electrical connector and the second electrical connector are physically separated from each other;
- and
- a third portion completely separating the first electrical connector and the second electrical connector from each other, wherein the first portion, the second portion, and the third portion form a single continuous layer.
5 more elements
A package comprising:
- a first package component comprising:
- a package substrate;
- a device die bonded to a top surface of the package substrate;
- an encapsulating material encapsulating the device die therein;
- a first electrical connector with a first portion in the encapsulating material, and a second portion protruding out of the first electrical connector;
- a second package component over the first package component, the second package component comprising a second electrical connector;
- and
- an integral metal layer formed of a non-solder metallic material, the integral metal layer being a single continuous layer that comprises:
- a first portion on a first sidewall surface of the first electrical connector, wherein at least a portion of the first portion of the integral metal layer is encapsulated in the encapsulating material;
- a second portion on a second sidewall surface of the second electrical connector;
- and
- a third portion completely separating the first electrical connector and the second electrical connector from each other, wherein the first portion, the second portion, and the third portion form a single continuous layer.
9 more elements
A package comprising:
- a first package component comprising a first electrical connector, wherein the first electrical connector comprises a first surface and first sidewall surfaces;
- a second package component comprising a second electrical connector, wherein the second electrical connector comprises a second surface and second sidewall surfaces;
- and a first metal layer formed of a non-solder metallic material comprising:
- a first portion contacting the first sidewall surfaces;
- a second portion contacting the second sidewall surfaces;
- and
- a third portion, wherein entireties of the first surface of the first electrical connector and the second surface of the second electrical connector are in contact with the third portion of the first metal layer, wherein the first portion, the second portion, and the third portion are formed of a same material, and are connected as a continuous region, and the third portion of the first metal layer fully separates the first electrical connector from the second electrical connector.
4 more elements
Dependencies are inferred from the claim text.