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US 10,483,228 B2Granted
Apparatus for bonding semiconductor chip and method for bonding semiconductor chip
AssigneeProtec Co., Ltd.
InventorGeunsik Ahn
Life of this patent
Estimating the term…
Abstract
Provided are a semiconductor chip bonding apparatus and a semiconductor chip bonding method, and more particularly, to an apparatus and method of bonding a semiconductor chip to an upper surface of a substrate or another semiconductor chip. According to the semiconductor chip bonding apparatus and the semiconductor chip bonding method, productivity may be increased by quickly and accurately bonding a semiconductor chip to a substrate or another semiconductor chip.
Claims9
A semiconductor chip bonding apparatus, comprising:
- a fixing member configured to fix a lower surface of a plurality of chip-substrate assemblies in which a non-conductive resin layer and a semiconductor chip are sequentially stacked on a substrate;
- a pressing member arranged above the fixing member, the pressing member comprising a transparent portion through which a laser beam penetrates;
- a lifting member configured to lift or lower one of the fixing member and the pressing member relative to the other of the fixing member and the pressing member to pressurize the semiconductor chips of the plurality of chip-substrate assemblies such that solder bumps of one of the semiconductor chips and the substrate penetrate the non-conductive resin layer to electrically contact the other of the semiconductor chips and the substrate;
- and
- a laser head configured to irradiate the laser beam to the chip-substrate assemblies pressurized by using the pressing member, through the transparent portion of the pressing member, so as to bond solder bumps of one of the semiconductor chips and the substrate to the other of the semiconductor chips and the substrate,
- wherein the pressing member further comprises a mask portion that is formed of an opaque material and supports the transparent portion,
- wherein the transparent portion of the pressing member is disposed in areas respectively corresponding to the plurality of chip-substrate assemblies,
- wherein the mask portion is disposed in a corresponding area between the plurality of chip-substrate assemblies.
5 more elements
A semiconductor chip bonding method, comprising:
- (a) forming a non-conductive resin layer on one of a lower surface of a semiconductor chip and an upper surface of a substrate;
- (b) disposing the semiconductor chip on the substrate to provide a plurality of chip-substrate assemblies in which the substrate, the non-conductive resin layer, and the semiconductor chip are sequentially stacked;
- (c) fixing the plurality of chip-substrate assemblies by using a fixing member to dispose the plurality of chip-substrate assemblies on the fixing member;
- (d) making one of a pressing member and the fixing member draw near the other of the pressing member and the fixing member by using a lifting member such that solder bumps of one of the semiconductor chip and the substrate penetrate the non-conductive resin layer to be in electrical contact with the other of the semiconductor chip and the substrate, wherein the pressing member is disposed above the fixing member and comprises a transparent portion through which a laser beam penetrates, wherein (d) is performed by using the pressing member comprising the transparent portion disposed in areas respectively corresponding to the plurality of chip-substrate assemblies, and a mask portion that is disposed in a corresponding area between the plurality of chip-substrate assemblies is formed of an opaque material and supports the transparent portion;
- and
- (e) bonding solder bumps of one of the semiconductor chip and the substrate to the other of the semiconductor chip and the substrate by irradiating a laser beam to the chip-substrate assemblies between the pressing member and the fixing member by using a laser head through the transparent portion of the pressing member.
3 more elements
Dependencies are inferred from the claim text.