3DI solder cup

A semiconductor device assembly comprising:

• a first substrate having a first surface and a second surface opposite the first surface, the first surface having at least one under bump metal (UBM) disposed thereon;
• a second substrate having a first surface and a second surface opposite the first surface, the second substrate disposed over the first substrate, the second substrate having at least one solder cup on the second surface, the at least one solder cup comprising a pillar and a barrier on an exterior of the pillar, the barrier having a first end proximal to the second surface of the second substrate and a second end distal to the second surface of the second substrate, the barrier extends from the first end to the second end along the exterior of the pillar and being open at the second end, the pillar comprising solder positioned within an interior of the barrier, the opening at the second end of the barrier having a first perimeter and the UBM having a second perimeter, the first perimeter being larger than the second perimeter;
• wherein the solder cup and UBM are connected together to form a support between the first substrate and the second substrate;
• and
• wherein the UBM is encased by the solder positioned within the interior of the barrier.