Warpage balancing in thin packages

A microelectronic structure, comprising:

• a carrier or a package having a first surface and a second surface opposite the first surface;
• a reinforcement layer disposed on the second surface of the carrier or the package, the reinforcement layer including one or more openings to reveal one or more electrical contacts on the second surface, the reinforcement layer arranged to add structural support to the carrier or the package;
• and
• a plurality of conductive terminals disposed within the one or more openings and coupled to the one or more electrical contacts, the conductive terminals making partial contact or no contact with the reinforcement layer.