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AssigneeNikon Corporation
InventorsIsao Sugaya, Kazuya Okamoto, Hajime Mitsuishi, Minoru Fukuda
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A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.
A substrate stacking apparatus that stacks a first substrate and a second substrate on each other, to make a substrate stack, which is separable from the substrate stacking apparatus, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first substrate and the second substrate, and then expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein
A substrate processing method for stacking a first substrate and a second substrate on each other, to make a substrate stack, which is separable from a substrate stacking apparatus, by forming a contact region, where the first substrate held by a first holding section of the substrate stacking apparatus and the second substrate held by a second holding section of the substrate stacking apparatus contact each other, at one portion of the first substrate and the second substrate, and then expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein
Dependencies are inferred from the claim text.