Semiconductor device
AssigneeToshiba Memory Corporation
InventorsMasatoshi Watarai, Masanori Hatakeyama, Takuya Kusaka, Kazunori Masuda, Masato Endo, Koichi Fukuda, Masato Sugawara
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AssigneeToshiba Memory Corporation
InventorsMasatoshi Watarai, Masanori Hatakeyama, Takuya Kusaka, Kazunori Masuda, Masato Endo, Koichi Fukuda, Masato Sugawara
Estimating the term…
According to one embodiment, the insulating layer is provided on the terrace portions. The plurality of contact portions extend through the insulating layer in the stacking direction and contact the terrace portions. The second columnar portion extends through the insulating layer and through the second stacked portion in the stacking direction, and includes a second semiconductor body contacting the first semiconductor region. The first insulating portion divides the first semiconductor region in the first direction. The first insulating portion is provided under a boundary portion between the first stacked portion and the second stacked portion.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.