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US 10,483,196 B2Granted
Embedded trace substrate structure and semiconductor package structure including the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorYu-Ying Lee
Life of this patent
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Abstract
A substrate structure includes a carrier, a first metal layer, a circuit layer and a dielectric layer. The carrier has a first surface and a second surface. The first metal layer is disposed on the first surface of the carrier. The circuit layer is disposed on the first metal layer. The dielectric layer covers the circuit layer and defines a plurality of openings to expose portions of the circuit layer and portions of the first metal layer.
Claims18
A substrate structure, comprising:
- a carrier having a first surface and a second surface;
- a first metal layer disposed on the first surface of the carrier, wherein the first metal layer includes a base metal layer and a conductive metal layer, the base metal layer is disposed on the first surface of the carrier, and the conductive metal layer is disposed on the base metal layer;
- a circuit layer disposed on the conductive metal layer of the first metal layer;
- and
- a dielectric layer covering the circuit layer and defining a plurality of openings to expose portions of the circuit layer and portions of the first metal layer.
2 more elements
A semiconductor package structure, comprising:
- a circuit layer having a first surface and a second surface;
- a dielectric layer covering the first surface of the circuit layer and having a first surface and a second surface, wherein the dielectric layer defines an opening to expose a portion of the circuit layer, and the opening extends through the dielectric layer;
- a semiconductor die attached to the circuit layer by flip chip bonding;
- a connecting element electrically connecting the semiconductor die and the circuit layer, wherein at least a portion of the connecting element is disposed in the opening of the dielectric layer and is exposed from the second surface of the dielectric layer;
- and
- a protection layer disposed on the second surface of the dielectric layer to cover the circuit layer, wherein the protection layer defines a plurality of openings to expose portions of the second surface of the circuit layer.
3 more elements
Dependencies are inferred from the claim text.