Power conversion apparatus
AssigneeHonda Motor Co., Ltd.
InventorsTakahiro Uneme, Yuko Yamada
Life of this patent
Estimating the term…
Abstract
A power conversion apparatus mounted in a vehicle includes a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolants including coolant passages are disposed by being alternately stacked, and a retaining unit which presses the semiconductor stack in a stacking direction to retain the semiconductor stack. The semiconductor modules and the coolants are attached to each other by a plate-shaped insulating resin adhesive member, and a roughened area on which a roughening treatment has been performed is formed in at least a part of the outer surface of the coolants to which the resin adhesive member is attached.
Claims12
A power conversion apparatus mounted in a vehicle, comprising:
- a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolant bodies are disposed by being alternately stacked, wherein the plurality of coolant bodies includes coolant passages;
- and
- a retaining unit which presses the semiconductor stack in a stacking direction to retain the semiconductor stack,
- wherein the plurality of semiconductor modules and the plurality of coolant bodies are attached to each other by a resin adhesive member, and a roughened area on which a roughening treatment has been performed is formed in at least a part of an outer surface of the plurality of coolant bodies to which the resin adhesive member is attached, and wherein the roughened area is formed on an entire outer surface of the plurality of coolant bodies.
A power conversion apparatus mounted in a vehicle, comprising:
- a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolant bodies are disposed by being alternately stacked, wherein the plurality of coolant bodies includes coolant passages;
- and
- a retaining unit which presses the semiconductor stack in a stacking direction to retain the semiconductor stack,
- wherein the plurality of semiconductor modules and the plurality of coolant bodies are attached to each other by a resin adhesive member, and a roughened area on which a roughening treatment has been performed is formed in at least a part of an outer surface of the plurality of coolant bodies to which the resin adhesive member is attached, and
- wherein the roughened area and a non-roughened area on which the roughening treatment has not been performed are formed on a surface facing the plurality of semiconductor modules in the outer surface of the plurality of coolant bodies, and the roughened area extends to an outer side of a first metal plate and a second metal plate in the plurality of semiconductor modules in a sectional view in the stacking direction.
Dependencies are inferred from the claim text.