Electronic package and fabrication method

A method for fabricating a package which includes a support plate, an encapsulation cap having a front wall and a peripheral wall with at least one local recess on an outer surface and at least one electronic integrated circuit chip, the method comprising the following steps:

• fixing said electronic integrated circuit chip onto a front face of said support plate;
• depositing a bead of glue over at least a part of a peripheral zone of said front face of the support plate;
• placing said encapsulation cap on top of the front face of said support plate in a position such that an end edge of said peripheral wall is placed at least partly on said bead of glue and at least one local point of said bead of glue is uncovered at said at least one local recess;
• locally hardening a first portion of the bead of glue by a first hardening process, said first portion positioned at the at least one local point where local recess is located;
• and
• hardening a second portion of the bead of glue different from the first portion by a second hardening process that is performed after completion of the first hardening process.

A package, comprising:

• a support plate having a front face;
• an electronic integrated circuit chip mounted on the front face of the support plate;
• an encapsulation cap comprising a front wall extending in front of the electronic integrated circuit chip and a peripheral wall having an outer surface and having an end edge that extends parallel to the front face of the support plate, the support plate and the encapsulation cap delimiting at least one chamber in which the electronic integrated circuit chip is situated;
• a bead of glue inserted between said end edge of the peripheral wall of the encapsulation cap and the front face of the support plate;
• wherein a first portion of the end edge of the peripheral wall has a first thickness and wherein a second portion of the end edge of the peripheral wall has a second thickness that is less than the first thickness, said second thickness defined by a local hollowed-out recess present in the outer surface of the peripheral wall, said local hollowed-out recess uncovering a local portion of the bead of glue.